Assembly2018-09-16T17:40:00+00:00

Assembly

  • SMT: 00501, BGA, MicroBGA, CSP’S, Flip Chips

  • Pin Through Hole

  • High Density Press Fit connectors

  • Stencil-less jet solder printing

  • 13 Zone Convection Reflow

  • Cable Assembly

  • High Speed Gold Ball Wirebonding

  • Box Build

  • Custom process development

  • Complete system integration

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