Rework2018-09-16T18:02:12+00:00

Rework

  • High Volume, Quick Turn BGA, PBGA, CBGA, CSP, LGA

  • Rework & Inspection

  • BGA, CCGA, CBGA, and Micro BGA Component Reballing

  • Customized Component and Board Reflow Process Development

  • Component underfill

  • Mandatory baking and dry air enviroment

  • Complete automation for repeatability

  • IR monitoring of the temperature profile

  • PCB and traces repair

 Call Us (408)293-3560

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