Key factors in analyzing the services of an ECM partner
Choosing an Electronics Contract Manufacturer partner can be a difficult task. Outsourcing ECM services (from design to reworks and prototyping) can carry huge benefits, but the risks connected to partnering with the wrong type of provider can also be considerable. Beyond simply analyzing the service list of the ECM company, there are several key factors to take into account. Below, we’ll cover some of the main aspects of an electronics and design service approach that ABC Assembly has defined over the years.
Experience in High-Complexity Services
While it may seem completely obvious that more experienced service partners are preferable, there are deeper implications to this consideration. ECM companies that have spent more than a decade in the industry not only usually follow higher quality standards but they also are more likely to deliver on high-complexity services that require finesse and niche knowledge.
Examples of this are flip chip reworks and BGA reworks and wire-bonding as repair and rework services that are done by very few ECM companies, as they require responsible handling, specialized tools, and above all – experienced specialists that know their way around flip chip BGAs. Flip chip designs often offer superior performance to cost, yet are notoriously tricky to handle, as you need a solidly flat mounting surface and thermal expansion precautions (flip chip connections can be rigid and prone to cracks if not used, reworked or repaired correctly).
Other nuanced considerations are present for services like wire-bonding but the bottom line is: an ECM partner with years of experience in supporting clients will be able to offer high-complexity support where other less seasoned providers will be limited in their capabilities.
Comprehensive Approach to Design and Manufacturing
Few companies realize how important it is for their ECM partner to have equal expertise in both design and manufacturing/assembly until they run into a provider that does not combine both. The reality is that you are going to be communicating constantly during complex projects and the quality of feedback and understanding will determine the level of the result.
Electronic Contract Manufacturers that have equal knowledge in design and production will see eye to eye with you on high-complexity needs and understand your requests in prototyping, electronics hardware design and use the most sophisticated software and web tools.
Advanced Equipment
Electronics design and manufacturing is a constantly changing industry due to the growing rate of technological progress. This places certain demands on the equipment used by ECM companies. ABC Assembly’s equipment base has been gathered and updated over the years to handle anything from High Mix/Low volume to mass production quantities, enabling us to deliver orders quickly and flexibly.
Customer Support and QA
Customer support and quality assurance should always be emphasized as a focus area for a high-level ECM company due to the high-finesse nature of the work. ABC Assembly adheres to the following QA protocols to safeguard our customers:
- ISO 9001-2015 certified Quality Control
- IPC 610 – A Workmanship Standards
- Rigid Compliance to Customer Documentation
- Incoming Inspection / Monitoring, Auditing of all Components
- Electrostatic Discharge Protection
- Quality Control in every stage of the process
- Comprehensive Control Testing: AOI, 3D X-Ray, Ersascope
- Visual, In-Circuit, Functional and Burn In tests.
ABC Assembly is an Electronics Contract Manufacturer with more than 20 years of experience in the industry. We offer an exceptionally high level of electronics services backed by deep engineering and design knowledge and
The list of ABC Assembly Services includes:
DESIGN SERVICES
Hardware: FPGA; DSP; Ethernet; Wireless; PCI – PCIe; RF.
Software: OrCAD; GC Power Place; Autocad; Cadence Allegro; 3D Studio Max; VxWorks;
Web: PHP; Ruby On Rails; C++; ASP.NET; Java; Flash.
LAYOUT SERVICES
Layout tools: Mechanical – AutoCAD, 3D Solidworks; Electrical – OrCAD, PCAD, PADS; ALLEGRO; ProTel; ViewLogic.
Simulation tools: ModalTek (Verilog verification); Eagleware (RF!).
ASSEMBLY SERVICES
SMT: 00501, BGA, MicroBGA, CSP’S, Flip Chips; Pin Through Hole; High Density Press Fit connectors; Stencil-less jet solder printing; 13 Zone Nitrogen Convection Reflow; Cable Assembly; Gold Bal; Wedge Wire and Ribbon bonding; Box Build; Custom process development;Complete system integration.
WIRE-BONDING SERVICES
Clean Room Environment; Automatic Die Placement; Mandatory Plasma Cleaning; Thermal and Electro Conductive die bounding; Precision dispensing; Online and off line Programming; High Speed Gold Ball Wire-bonding; Pull and Shear Test; Encapsulation; Wire and Ribbon (up to 10 mil) wedge bonding.
REWORK SERVICES
High Volume, Quick Turn BGA, PBGA, CBGA, CSP, LGA; Rework & Inspection; BGA, CCGA, CBGA, and Micro BGA Component Reballing; Customized Component and Board Reflow Process Development; Component underfill; Mandatory baking and dry air environment; Complete automation for repeatability; IR monitoring of the temperature profile; PCB and traces repair.