Assembly2020-02-05T08:50:20+00:00

Assembly

  • SMT: 00501, BGA, MicroBGA, CSP’S, Flip Chips

  • Pin Through Hole

  • High Density Press Fit connectors

  • Stencil-less jet solder printing

  • 13 Zone Nitrogen Convection Reflow

  • Cable Assembly

  • Gold Ball, Wedge Wire and Ribbon bonding

  • Box Build

  • Custom process development

  • Complete system integration