Rework
High Volume, Quick Turn BGA, PBGA, CBGA, CSP, LGA
Rework & Inspection
BGA, CCGA, CBGA, and Micro BGA Component Reballing
Customized Component and Board Reflow Process Development
Component underfill
Mandatory baking and dry air enviroment
Complete automation for repeatability
IR monitoring of the temperature profile
PCB and traces repair